Apple is set to launch two new phones at the start of September in the form of the iPhone 6S and iPhone 6S Plus, with an announcement heavily rumoured for September 9. The source, whose accuracy with Apple rumors isn’t established, posted a bunch of alleged iPhone 6s schematics on Weibo and additional details about the iPhone 6s.
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The leaked schematics also reveal the CPU shielding cover of the iPhone 6S with heat dissipation fins that has a thickness of merely 1 mm, while the processing package is around 15% smaller in comparison to the A8 system chip used in the iPhone 6. And as far as we can tell, the schematics do seem to resemble, at least in shape, the layout of an iPhone motherboard. SiP design made it possible to integrate smartphone-grade components in the Apple Watch, as these parts previously wouldn’t fit into a watch.
Germany is a first-wave country for Apple products, with the devices more than likely to launch in the UK and US on the same date.
The current leak also reveals that the iPhone 6s is poised to be quite a power-packed performer as the handset scored 1811 on the single-core test, which is much higher than competing Android flagships such as the LG G4, HTC One M9 and Samsung Galaxy S6. The tech requires additional display hardware to register the differences between touches. In fact the company is working on their OS to fully implement the Force Touch technology.
Obviously, this is just speculation based on recent leaks, all yet to be confirmed by Apple.
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A supposed prototype of the iPhone 6s has allegedly leaked and is fueling the assertions.
