This is a change of -0.07% from open which creates a gap of 1.27%. The stock traded with the volume of 6.42 Million in the last trading session. The last bid price was called at $29.00 and the ask price was stated at $29.18. The bid price represents the maximum price that a buyer or buyers are willing to pay for a security. The company has a market cap of $152.94B. The stock appeared -1.05% below its 52-week highs and is up 1.71% for the last five trades.
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The average true range of Taiwan Semiconductor Manufacturing Company Limited’s (TSM) is recorded at 0.39 and the relative strength index of the stock stands 66.94. Microchip Technology Incorporated has an EPS ratio of 0.37. Recently, stock has been recommended as “BUY” from “12” and “5” given “OVERWEIGHT” rating for the company. Average volume for Taiwan Semiconductor Manufacturing Company Limited, is 6700.44, and so far today it has a volume of 6047100. Mean recommendation on this stock is 2.70.
Taiwan Semiconductor Manufacturing Company Ltd. annual Divided is 0.94 while it’s Dividend Yield is 3.19%.
The price/earnings ratio (P/E) is 16.99 and the forward P/E ratio stands at 14.58. Its share price has dropped -20.28% in three months and is down -7.08% for the last five trades.
The company has its Return on Assets (ROA) of 16.9 Percent. The stock is now offering a return on equity of 23.50% while the return on assets is at 16.90% and the return on investment is at 18.70%.
The stock is now trading at Distance from 20-Day simple moving Average of 2.04% whereas, Distance from 50-Day Simple moving average is 5.92 Percent and Distance from 200-Day Simple Moving Average of 21.74 percent.
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There are 17 exhibition areas at this year’s exhibition, with many of them being dedicated to SEMICON’s standing themes, such as those about semiconductor materials and components. The stock price is moving up from its 20 days moving average with 0.31% and isolated positively from 50 days moving average with 1.30%. It operates through foundry segment, which engages in manufacturing, selling, packaging, testing and computer-aided design of integrated circuits and other semiconductor devices and the manufacturing of masks.
